Condor Sigma

Technology Leader in Bond Testing Worldwide

Performance & Flexibility

With 15+ years in-house experience, XYZTEC takes bond testing to a new level with the Condor Sigma. It combines the unique strengths of the Condor series with the latest technologies and innovations to set the new standard worldwide.

Whether you need a dedicated or multipurpose bond tester, it features unparalleled 0.075% accuracy, the best ergonomics, highest throughput, and the lowest cost of ownership.

0.075% Accuracy

24-bit Resolution

Up to 200kgf Force

Revolving Measurement Unit (RMU)

The Sigma RMU raises new standards with the capability to be configured with up to 6 sensors in any combination of pull or shear, ranging from 10gf to 200kgf. Sensors are permanently fixed, requiring no warm-up time.

Maximum Compatibility

Use your existing stock of work holders and tooling with our shuffle plate. Compatibility modes ensure consistency in measurement results across machines.

Advanced Vision & Soft Landing

Supports up to three live camera views at the same time. Features programmable landing forces and the most precise step-back accuracy in the industry.

Powerful Intuitive Software

The Condor Sigma software supports various authorization levels, featuring an easy-to-learn operator screen. Engineers get full control of the production process through powerful statistical process control (SPC) and clear graphs.

Compatible with Windows 7/8™ (32 & 64 bit)
Integrated SPC and system GR&R analysis
Export to XLS, DOC, PPT, PDF, CSV, XML, etc.

Condor Sigma Operator Screen and SPC Graphs

Technical Specifications

Category	Features & Capabilities
Force Sensors	Revolving (up to 6 sensors) or Single (1 sensor). Ranges: 10gf to 200kgf. ±0.075% Accuracy, 24-bit resolution.
Stages & Axis	30nm resolution built-in linear encoders. Travel: X=370mm, Y=168mm, Z=168mm. Speed up to 50mm/s.
Supported Tests	Wire pull, Ball shear, Die shear, Solder ball shear, Ribbon pull, Copper pillar, Stud pull, Creep/Fatigue tests, and more.
Frame & Size	Footprint: 620mm (X) x 558mm (Y) x 608mm (H). Weight: 75-85 kg.
Controls	Ergonomic layout to SEMI S8. Two joysticks with 6 buttons each. Microscope moves in focal arc.
Services	Electric 110-240V, single phase. No compressed air required.

Weber-G

Internationally Leading Supplier of Deep Learning AOI Systems

Wire Bonding Inspection Equipment

This equipment is mainly applied to detect various defects on the Die surface, die bonding, wire bonding, and lead frame surfaces during the semiconductor die attachment and wire bonding manufacturing processes. It fully supports the automated optical inspection of gold wires after module component bonding.

The core gold wire detection parameters include: gold wire count, wire shifting, bonding point shifting, and abnormal wire morphology profiles.

±1μm XY Motion Accuracy

2.7μm Optical Resolution

1100kg Heavy Duty Stability

3D Detection & Imaging Capability

Features complete Wire Bonding (WB) 3D imaging capabilities. It utilizes a multi-layer focusing function and an infinite depth of field to deliver exceptionally clear imaging across the entire processing board.

Zero-Negative Sample AI System

Integrates an industry-exclusive zero-negative sample AI detection framework. Powered by deep neural networks trained with extensive datasets, it achieves complex appearance and structure defect detection.

High-Precision Hardware & Optics

Built with a high-density marble platform to ensure structural assurance for high-precision imaging. Multi-angle light sources combined with high-resolution industrial cameras and telecentric lenses vastly enhance defect visibility.

Self-Developed AAM System

Equipped with the latest self-developed AAM absolute precision measurement system. This enables the machine to accurately pinpoint and detect both wire aluminum trace and wire bonding process variations.

AI Detection Training System

Engineers gain deep process control through the AI Big Data Training Center, providing robust tracking from raw products to final analytics. The software features an offline programming mode to maximize machine uptime.

Integrated SPC with data statistics, pattern analysis, and flexible data exporting.
Full MES Communication supporting E-mapping import/output and customizable layouts.
Review Station capabilities enabling precise secondary manual judgment on detected defect logs.
Advanced auxiliary options including remote centralized re-judgment, barcode readers, and OCR.

Technical Specifications

Category	Features & Capabilities
Vision System	12MP Industrial Camera (21MP optional). 2.7μm resolution. FOV Size: 11*8.5mm. Minimum detectable defect: 5.4μm. RGBW LED illumination.
Motion Mechanism	AC Servo Motor for XY movement with ±1μm accuracy. Customizable flow direction. Z-axis travel range: ≤30mm. Track height: 900±30mm.
Hardware & Size	Power: 200V-230V AC 50/60Hz. Power rating: 2.2KW. Air pressure requirement: 0.4-0.6MPa. Machine Weight: 1100kg. Dimensions: W1156 * D1475 * H1650 mm.
Inspection Criteria	Substrate Size: 5050mm to 510460mm. Substrate Thickness: 0.6-6mm. Measurement Height: Clear imaging for components >10mm.
Detected Items	Substrate defects, component faults, gold wire lifting, bending, missing wires, wire breakage, die contamination/dirt, structural damage, and surface scratches.
Environment	Operating Temperature: 20°C ~ 25°C. Humidity Requirements: 45%RH ~ 65%RH (Strictly non-condensing).

SCI Automation

Technology Leader in Plasma Cleaning, Etching, and Surface Treatment Worldwide

Performance & Precision Cleaning

Founded in January 2000, SCI Automation provides advanced, highly effective plasma cleaning and surface treatment solutions engineered for the Semiconductor, Electronic, Automotive, Medical, and Life Science industries. Our high-reliability systems are fully built in Singapore and deployed globally.

Through an extensive network of highly trained engineers and localized branches, SCI guarantees excellent product quality, full technical traceability, and dependable 24/7 after-sales service support.

Est. 2000 Global Solutions

24/7 Operational Cycle

SMEMA Inline Protocol

Core Plasma Systems

Quadrioα

SCI Automation Quadrio-Alpha Standalone Plasma System

A standalone strip plasma system that builds upon a legacy framework first deployed in 2004 across major semiconductor factories. Equipped with completely redesigned PC controller software and updated hardware, it delivers exceptionally repeatable, consistent plasma operations and comprehensive data tracking for total process traceability.

QML System

SCI Automation QML Inline Strip Plasma System

Engineered explicitly to handle strip form factor substrates directly inline. It interfaces seamlessly with upstream and downstream assembly mechanisms via the SMEMA protocol. Recognized as the smallest inline system on the market, it ensures reliable and repeatable cycling for continuous 24/7 runtime.

QML-CI

A compact inline system that delivers the exact high-performance plasma cleaning capabilities of the standard QML unit. It offers enhanced flexibility to process carriers, Auer boats, and ceramic substrates, featuring a dedicated conveyor belt and indexer system for fully automated assembly integration.

Industrial Plasma Applications

SCI Automation systems deliver excellent surface modification capabilities crucial for high-yield packaging operations. Key process applications include:

Lead Frame Cleaning: Decontamination of copper or coated lead frames prior to wire bonding.
Oxide Removal: High-efficiency target reduction of surface oxides.
Adhesion Promotion: Advanced surface activation executed immediately prior to component molding.
Package Decontamination: Mild etching applications and residual flux removal from semiconductor packages or hybrids.

Technical & Service Specifications

Category	Features & Capabilities
Core Solutions	Quadrioα (Standalone Strip), QML (Smallest Inline Strip System), and QML-CI (Inline Boat/Ceramic Carrier System).
Interface Protocol	SMEMA protocol fully integrated on inline equipment for seamless automated upstream and downstream machine handshakes.
Material Handling	Supports strip form factors, industry-standard boats, Auer boats, and advanced ceramic substrate arrays.
Traceability	Completely redesigned software architecture and PC control interfaces built for strict process parameter logging and verification.
Global Support	Intensively factory-trained service teams with localized spare parts hubs ready for rapid global shipment and deployment.

X-EYE 6200

Advanced In-Line 2D Automated X-Ray Inspection (AXI) System

High-Speed Non-Destructive Inspection

The X-EYE 6200 is an advanced In-Line 2D Automated X-Ray Inspection (AXI) System manufactured by SEC (South Korea). It is designed for high-speed, non-destructive inspection of electronic components and printed circuit board assemblies (PCBAs) during production. The system automatically detects hidden defects that cannot be seen through ordinary visual inspection.

Utilizing high-resolution X-ray imaging technology, the system inspects solder joints, semiconductor packages, wire bonding, and other electronic assemblies. It is integrated directly into production lines, allowing real-time quality control and defect detection without interrupting manufacturing processes.

0.5–1s Inspection Speed / FOV

Up to 0.8 µm High Resolution

160 kV Hybrid X-Ray Tube

Key System Features

High-speed in-line 2D X-ray inspection.
Automatic Good/No Good (OK/NG) judgment logic.
Long-life hybrid X-ray tube (up to 10,000 operating hours).
Wire Automatic X-ray Inspection (WAXI) capability for precise wire bonding analysis.

Common Defects Detected

BGA solder bridging and short circuits.
Voids in solder joints and misalignment of chips.
Manhattan / tombstoning defects.
Broken, missing, double bonding, or wire sweep defects.

Industry Applications

PCB Assembly (PCBA) manufacturing lines.
Semiconductor packaging & automotive electronics.
Mobile device production & high-spec camera modules.
LED, battery, and sensor component manufacturing.

AXI Imaging & Judgment Logic

The diagram shows the internal inspection cycle of the X-EYE 6200. High-intensity X-rays are emitted downward from the 160 kV tube passing through the PCBA assembly components transiting live over the automated line conveyor belt.

The ultra-precise 1.6 MP Flat Panel Detector underneath captures dense structural projections instantly. In a fraction of a second (0.5–1s per field of view), the internal core execution algorithm maps and verifies the layout, tracking out wire paths and automated classification metrics.

Technical Specifications

Specification Key	System Equipment Details
X-Ray Tube	160 kV / 500 µA Open-Type Hybrid Tube Configuration
Detector Type	1.6 MP High-Speed Digital Flat Panel Detector (FPD)
Spatial Resolution	0.8 µm to 15 µm software scalable focal depth range
Inspection Methods	In-Line 2D AXI / Automated Wire X-Ray Analysis (WAXI)
Inspection Targets	BGA Arrays, QFN, QFP packages, Micro-chips, Fine Gold/Al Wire Bonds
Table / Board Size	Min: 50 × 50 mm to Max: 330 × 250 mm Processing Capacity
System Dimensions	1000 mm(W) × 1360 mm(D) × 1450 mm(H) Cabinet Floor footprint
System Weight	Approx. 2,000 kg Heavy Duty Reinforced Anti-Radiation Frame

Documentation Context Notes: The X-EYE 6200 is an in-line X-ray inspection machine utilized in electronics manufacturing to ensure product quality and reliability. It automatically detects hidden defects such as solder bridging, voids, misalignment, and wire bonding issues in PCB assemblies and semiconductor packages. By providing rapid and accurate inspection results, the system helps manufacturers reduce defects, improve production efficiency, and maintain high-quality standards throughout the manufacturing process.

Advanced Semiconductor, Inspection, Assembly & Packaging Solutions

New Sigma HF/HA Bond Tester

Designed specifically for handling high-force test assignments and accommodating large active surface areas during semiconductor verification processes. It serves as a dependable platform for ruggedized industrial components.

1000 kgf Max Force Capacity

250 mm/s High Axis Speed

80 mm Deep Access Travel

Heavy Module Testing

Typically engineered to support high-reliability processing requirements for IGBT and heavy power modules.

Ergonomic Cabinet Structure

Features an advanced SEMI S2 compliant safety cabinet configuration optimized with responsive integrated visual feedback systems.

Flexible Probe Alignment

Equipped with a flexible multi-workholder positioning mechanism coupled alongside an agile 360° rotating head design.

Sigma W8 Wafer Automated Tester

Engineered to deliver high-capacity automation paradigms directly to precision wafer-level verification routines. Built to ensure clean operation and damage-free manipulation.

4" to 8" Wafer Diameters

1gf - 10kgf Testing Forces

50 µm Down to Bump Pitch

Intelligent Handling Systems

Features automated cassette mapping matrices complemented by empty slot recognition to eliminate machine tracking errors.

High Precision Stages

Equipped with rigid, ultra-precise mechanical XY stages tracking across a generous 370 x 370 mm footprint.

Sigma MAG Frame Bond Testing System

A continuous high-yield inspection setup dedicated entirely toward executing high-reliability frame testing sequences.

Full Automation Framework

Nano Shear Height Control

AGV/OHT Ready Integration

Dynamic Track Configuration

Features automatic track width adjustment structures that swiftly conform to incoming production formats.

Smart Map Routing

Utilizes intelligent processing architectures that execute automated wafer and strip map selection routines.

CA20 3D Void Inspection System

A non-destructive inspection unit engineered to grant three-dimensional structural insights into solder bumps within minutes.

300 nm Defect Detectability

Non-Destructive 3D Diagnostics

Automated Void Insights Analysis

Highly Repeatable Metrics

Engineered with stable hardware modules designed to support continuous, highly precise, and reliable daily test routines.

Sensory Safe Systems

Includes an intelligent software-assisted Dose Manager system aimed at shielding X-ray sensitive component modules during testing.

Cougar & Cheetah X-Ray Inspection Systems

Advanced diagnostic platforms designed for both precision microfocus imaging and high-throughput production line inspection.

Software: VoidInspect Automated & Compliant

Precision: Microfocus Fine Geometry & Real-Time Void Calculation

Performance: High-Throughput Production & Multi-Layer BGA Diagnostics

UX20 Radioscopic & UX50 Heavy-Duty CT Inspection Stations

Advanced X-ray at CT inspection solutions para sa multi-material profiles at complex internal structural assemblies.

Dual Modality: X-Ray & CT

Ease of Use: Effortless Navigation Interface

Precision: Advanced Casting Assessment

Performance: High Energy CT Scaling & Deep Penetration

Analysis: 3D Volumetric Modeling Suite

Weber - Wirebond 3DAOI

A high-precision inspection platform applied to locate sub-micron structural flaws across raw frames, wire paths, and semiconductor attachments.

±1 μm XY Motion Accuracy

2.7 μm Optical Resolution

1100 kg Massive Marble Base

Advanced AAM Integration

Utilizes self-developed Absolute Precision Measuring hardware to monitor micro-fine shifting profiles along wire loops.

Zero-Negative Sample AI

Employs deep neural networks trained via massive datasets to perform comprehensive defect filtering without missing outliers.

Post Wave Soldering AOI Station

A targeted downstream automated optical detection rig designed to map structural flaws instantly after boards exit wave solder channels.

Post-Reflow Optimization

Solder Ball Outlier Pinpointing

Extra Component Verification

Spectra Wafer AOI Platform

A high-end, micro-step substrate visual mapper focused entirely on scanning diced arrays and raw wafer profiles for microscopic defects.

Wafer Level Scanning

Copper Leakage Detection

Excess Solder Isolation

Laser Marking Machine System

An inline serialization processing solution geared to burn persistent tracking metrics, codes, and corporate branding onto electronic packages.

High Vel. Laser Trace

Micro Etching Control

MES Code Synergy

Leica Industrial Microscope Solutions

Comprehensive range of precision optical platforms for material analysis, component inspection, and digital documentation.

Optical Types: Upright (Top-Down) & Inverted (Heavy-Load)

Stereo: 3D Spatial Depth Perception & Rework Adaptability

Digital: Eyepiece-Free Live Matrix Output & On-Screen Measurement

Precision: High-Res Telecentric & Failure Analysis Optimized

Emspira 3 Digital Microscope

An all-in-one digital workspace solution designed to optimize robust streamlined inspections, measurements, and direct code-sharing tasks.

Enersight OS Platform

Streamlined Data Archiving

Standalone Operation Mode

SEM VSA M350 Scanning Electron Microscope

A critical metrology and automated processing electron microscope intended to deliver nanoscale imaging and dimensional calculation array mapping.

Nano-Scale High Resolution

Mass Inspection Automated Suite

Area & Pseudo Color Mapping

SB² Jet Solder Ball Machine

An innovative localized micro-ball jet placement processing system utilizing laser reflow methods for advanced electronic connectivity.

40μm - 760μm Ball Diameters

Laser-Driven Fluxless Jet

30μm Qualification Ready

LAPLACE-FC Laser Flip Chip Bonder

An advanced packaging machine designed to apply rapid, localized laser heating profiles to fine-pitch substrate configurations without mechanical or flux clean-up requirements.

< 80μm Fine Pitch Seating

No Flux / No Tooling Stress

High CTE-Mix Laser Bonding

Ultrasonic Dry Cleaner (UDC) 6i Series

A high-speed non-contact micro-particle removal deck utilizing shockwave air acoustics to strip target surfaces of loose debris without liquids.

Zero Liquid Dry Wash

Ultrasonic Shockwave Air

Sub-Micron Debris Lifting

86 Series Fully Automatic Wirebonder

A flexible benchtop assembly platform capable of acting interchangeably as a high-precision wirebonder or an agile pull/shear testing platform.

512 x 720 mm Massive Work Area

Dual Duty Bonding & Testing

6-in-1 Multi-Head Interchanger

Battery Bond Adaptation

Provides optimized heavy-gauge tracking and large operational stages required for high-density automotive battery group bonding.

CZW Series High-Precision Coordinate Measuring Machine

A high-end metrology tool tailored to extend structural dimension mapping tolerances using visual first-capture architectures.

0.2 Sub-Pixel Edge Resolution

Image-First Measure-Later Mode

Accelerated Auto Positioning

X-Y AI Components Counter

An smart X-ray inspection cabinet configured to audit part inventory by instantly counting reeled SMD parts using neural algorithms.

>99.99% Counting Accuracy

7 to 15" Reel Support range

01005 Chip Minimum Part Size

ALPHA Table Top SEM

A desktop scanning electron microscope featuring rapid vacuum pumping cycles to execute accelerated structural material analytics.

90 sec Fast Vacuum Cycle

3D Volumetric Surface Rendering

Automated Particle Analysis

Jewel Box Desktop X-Ray System

An ultra-high resolution laboratory x-ray testing unit integrating precise multi-axis positioning mechanisms within a compact footprint.

Ultra-High Spatial Resolution

Microfocus Tube Integration

5-Axis Specimen Positioner

RTX-113 MicroTech Drilling Alignment Unit

A high-power magnification imaging platform engineered to check small-hole drilling precision across complex multilayer PCB layouts and dense BGA/QFN mounts.

High Power Optical Scope

Small Hole Drilling Guidance

Multilayer Board Interrogation

LumiSolarCell Combined EL/PL/IR System

A multi-spectrum desktop diagnostics station combining electroluminescence, photoluminescence, and infrared testing for analyzing solar cell crystals.

EL / PL / IR / Rs Quad Imaging

LED Powered High Flux Light

As-Cut Wafer Integrity Auditing

Skid Mounted Advanced UV-System

An industrial compact UV-oxidation fluid processing system engineered to execute large-scale disinfection workflows within advanced manufacturing environments.

Compact Skid Frame Layout

UV-Oxidation Advanced Process

Industrial Disinfection Flow

Large Panel Inline AOI Station

An inline ultra-wide layout automated visual scanning deck processing heavy backplane panels in real-time.

Up to 27” x 26.4” Panel Handling

450 Panels / Hr Peak Throughput

Real-Time Defect Tracking

VS320i Handling Vacuum Soldering Oven

A void-free thermal processing system utilizing deep closed-loop software control over isolated internal heating elements.

SECS / GEM Protocol Comms

Thermocouple Profiling Arrays

Optional Sintering Device Mech

VS320i Handling Vacuum Soldering Oven

An automatic production line soldering platform integrated with multi-axis automated transport belts and optional formic acid cleaning systems.

Y-Z Axis Robot Loading Mech

HCOOH Auto-Bubbler Refill

Power Load Heater Monitoring

Technical Reference Matrix

Equipment Category	Standard Features & Processing Scope
Precision Bond Testing	Forces spanning 1gf up to 1000kgf. Offers full 360-degree rotating tool heads, deep access reach (80mm), and nano-precise shear tracking heights. Includes automated cassette or frame handling links with SECS/GEM readiness.
X-Ray & Radioscopy Diagnostics	Sub-micron and nanometer defect detection pipelines. Automated void calculation powered by VoidInspect software extensions. Multi-axis manipulation with active Dose Management protection circuits.
Automated Optical Inspection (AOI)	3D multi-focus visual mapping featuring infinite depth of field tracking. High-accuracy movement (±1μm) anchored onto ultra-dense stone platforms. Neural network systems running clean zero-negative sample filtration.
Microscopy & General Metrology	Upright, inverted, digital, and stereo optics platforms. High-speed sub-pixel calculation loops (0.2 sub-pixels accuracy) combined with rapid chamber pumping routines under 90 seconds.
Advanced Packaging & Thermal Prep	Fluxless, contact-free localized laser bonding matrices down to pitch profiles <80μm. Dry atmospheric or deep vacuum plasma surface activation systems. Void-free soldering ovens featuring Formic Acid integration options.

Upgrade Your Production Line With Our Systems

World-Class Machinery

Complete Setup & Delivery

After-Sales Support

Interested in our equipment solutions?

Performance & Flexibility

Revolving Measurement Unit (RMU)

Maximum Compatibility

Advanced Vision & Soft Landing

Powerful Intuitive Software

Technical Specifications

Wire Bonding Inspection Equipment

3D Detection & Imaging Capability

Zero-Negative Sample AI System

High-Precision Hardware & Optics

Self-Developed AAM System

AI Detection Training System

Technical Specifications

Performance & Precision Cleaning

Core Plasma Systems

Quadrioα

QML System

QML-CI

Industrial Plasma Applications

Technical & Service Specifications

High-Speed Non-Destructive Inspection

Key System Features

Common Defects Detected

Industry Applications

AXI Imaging & Judgment Logic

Technical Specifications

New Sigma HF/HA Bond Tester

Heavy Module Testing

Ergonomic Cabinet Structure

Flexible Probe Alignment

Sigma W8 Wafer Automated Tester

Intelligent Handling Systems

High Precision Stages

Sigma MAG Frame Bond Testing System

Dynamic Track Configuration

Smart Map Routing

CA20 3D Void Inspection System

Highly Repeatable Metrics

Sensory Safe Systems

Cougar & Cheetah X-Ray Inspection Systems

UX20 Radioscopic & UX50 Heavy-Duty CT Inspection Stations

Weber - Wirebond 3DAOI

Advanced AAM Integration

Zero-Negative Sample AI

Post Wave Soldering AOI Station

Spectra Wafer AOI Platform

Laser Marking Machine System

Leica Industrial Microscope Solutions

Emspira 3 Digital Microscope

SEM VSA M350 Scanning Electron Microscope

SB² Jet Solder Ball Machine

LAPLACE-FC Laser Flip Chip Bonder

Ultrasonic Dry Cleaner (UDC) 6i Series

86 Series Fully Automatic Wirebonder

Battery Bond Adaptation

CZW Series High-Precision Coordinate Measuring Machine

X-Y AI Components Counter

ALPHA Table Top SEM

Jewel Box Desktop X-Ray System

RTX-113 MicroTech Drilling Alignment Unit

LumiSolarCell Combined EL/PL/IR System

Skid Mounted Advanced UV-System

Large Panel Inline AOI Station

VS320i Handling Vacuum Soldering Oven

VS320i Handling Vacuum Soldering Oven

Technical Reference Matrix

Complete Business Solutions You Can Trust

Complete Business Solutions
You Can Trust